Moseley Semiconductor Platform
See every molecule in the bay.
MSCC streams contamination risk across every dock, tool and load port — flagging AMC (Airborne Molecular Contamination) excursions before they touch the wafer.
MSCC streams contamination risk across every dock, tool and load port — flagging AMC (Airborne Molecular Contamination) excursions before they touch the wafer.
Our e-canisters mount inside FOUPs (Front-Opening Unified Pods), EFEMs (Equipment Front-End Modules), load ports and process chambers. A MOF-coated FBAR (Film Bulk Acoustic Resonator) array — 16 sensors arranged as four sensors per channel across four channels — detects HF, ammonia, NMP and organic outgassing in parts-per-billion. A TinyML (on-device machine learning) model on the canister's PCBA (printed-circuit board assembly), co-located with the sensor array, classifies risk in real time and pushes it straight to the bay view above so excursions are caught before they reach the wafer.
HF, NH₃, NMP, organic outgassing — caught before defects appear.
One canister per dock, FOUP or load port. Pinpoints the source, not the room.
Low / medium / high per asset, refreshed every second on the bay view.
Battery + PV powered, BLE (Bluetooth Low Energy) backhaul. No fab-network changes required.
The E-Array — a metal-cystine coordination complex sensor array inside the E-Aegis host platform — captures target molecules at ppb concentrations. Multiple metal centres, multiple sensing elements per metal, one reading per element per second.
E-Sentinel — the Moseley on-device ML model running on the host MCU (microcontroller unit) of the E-Aegis — fingerprints the full multi-channel response from the E-Array, separating HF from NH₃, NMP from siloxane, signal from drift.
A per-asset risk level (low / medium / high) is published over BLE — every dock, FOUP, load port and tool gets its own tile on the bay view.
Excursions trigger getter activation, FOUP purge, or operator alert via the existing fab MES. No new pipes, no new network.
Even in an ISO Class 3 cleanroom, ppb-level airborne molecular contamination from process chemistry, outgassing polymers and HVAC ingress can pit photoresist, corrode interconnects and tank yield. Here are the targets.
Acidic AMC — pits oxide and metal layers.
Basic AMC — destroys DUV photoresist sensitivity (T-topping).
Solvent outgassing from photoresist strippers.
From wet-bench piranha cleans — corrodes metallurgy.
Etch by-product — surface haze and dopant drift.
Siloxanes, phthalates — surface molecular condensation on optics.
We work with fab engineering teams to instrument a single bay end-to-end, validate against your existing reference instruments, and have the bay view live in under five working days.
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